Nova awarded SI Editors’ Choice 2004 Best Product Award

Nova’s integrated metrology systems for copper CMP are one out of 15 systems awarded by one of the leading magazines in the industry

Semicon Europa, Munich, Germany, April 22, 2004, – Nova Measuring Instruments Ltd. (NASDAQ: NVMI) has received the prestigious Editors’ Choice Best Product Award, presented annually by the Semiconductor International magazine, for its NovaScan 2020Cu and 3030Cu Integrated Metrology systems for Copper CMP process monitoring. Semiconductor International announced 15 commercially proven industry products for excellence in semiconductor manufacturing. The 2004 entrants exemplified state-of-the-art equipment and materials, installed and used in numerous fabs around the world. The awards were handed out to the winners during a festive event ceremony at the Semicon Europa show.

The NovaScan 2020Cu and 3030Cu non-contact, non-intrusive optical measurement systems using spectrophotometric and imaging technology provide integrated non-contact and fast erosion measurements, low-K cap layer removal and copper/barrier residues detection. These combined optical capabilities enable improved control of the polish process and elimination of time-consuming off-line measurements. The systems enable precise control of over-polishing and provide quantitative data on the electrical performance of the copper lines for the tightest possible wafer-to-wafer control. 100% sampling of the wafers for effective CLC that allow prevention of scrap and/or excursions, makes NovaScan 2020Cu and 3030Cu an efficient tool for the control of consumables. The NovaScan Copper systems are available on most polishers, both for 200mm and 300mm copper CMP processes. The patented technology for measurements on arrays is a key to real production implementation.

Dr. Giora Dishon, President and CEO, said: “We are very excited that our copper systems received this important award. Our customers continually report on exceptional performances of the process equipment with Nova’s integrated metrology systems for copper, reporting on cycle time reduction between 19 to 77 min. per lot, improvements in equipment and fab efficiencies, and overall increased productivity of the dual damascene copper CMP process. The NovaScan Copper systems have a tremendous potential for 90nm volume manufacturing and are now being implemented at 7 different sites for high volume manufacturing at major semiconductor manufacturers all over the world. The move to 90nm production on 300mm wafers provides a significant opportunity for us in this industry-wide upturn.”