Form 6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, DC 20549

 


 

FORM 6-K

 


 

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 OF

THE SECURITIES EXCHANGE ACT OF 1934

 

For the month of January, 2005

 


 

ChipMOS TECHNOLOGIES (Bermuda) LTD.

(Translation of Registrant’s Name Into English)

 


 

No. 1, R&D Road 1

Hsinchu Science Park

Hsinchu, Taiwan

Republic of China

(Address of Principal Executive Offices)

 


 

(Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.)

 

Form 20-F      ü          Form 40-F              

 

(Indicate by check mark whether the registrant by furnishing the information contained in this form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.)

 

Yes                      No      ü    

 

(If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): 82-            .)

 



SIGNATURES

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

    ChipMOS TECHNOLOGIES (Bermuda) LTD.
                                (Registrant)
Date: January 3, 2005   By  

/S/ S.J. Cheng


    Name:   S. J. Cheng
    Title:   Chairman & Chief Executive Officer


EXHIBITS

 

 

Exhibit
Number


   
1.1   Press Release


Exhibit 1.1

 

Contact:

 

In Taiwan R.O.C.

Dr. S.K. Chen

ChipMOS TECHNOLOGIES (Bermuda) LTD

886-6-507-7712

s.k._chen@chipmos.com.tw

 

In the U.S.

The Ruth Group

David Pasquale

+646-536-7006

dpasquale@theruthgroup.com

 

Hynix Semiconductor ENGAGES ChipMOS FOR DDR SDRAM PRODUCTS TESTING SERVICES

 

Hsinchu, Taiwan, Jan. 3, 2004 –ChipMOS TECHNOLOGIES (Bermuda) LTD. (“ChipMOS” or “the Company”) (Nasdaq:IMOS) announced today that ThaiLin Semiconductor Corp., (“ThaiLin”), one of the Company’s consolidated indirect subsidiaries, has been engaged by Hynix Semiconductor Inc. to provide testing services for DDR SDRAM products.

 

S.J. Cheng, Chairman and Chief Executive Officer of ChipMOS, said, “This latest agreement is another recognition of ChipMOS’ technology expertise and its ability to successfully partner with the world’s leading semiconductor companies to support their product roadmaps. We continue to successfully expand our customer base and engagements with existing customers because of the strategic investments we have made in advanced technologies, our geographic strength, the quality of our engineers and the commitment of our entire organization to ensuring the success of all customer programs.”

 

About Hynix Semiconductor Inc.

 

Hynix was founded on February 1983, under the laws of the Republic of Korea. The Company’s stock is publicly traded, and all issued and outstanding shares have been listed on the Korea Stock Exchange since the Initial Public Offering in December 1996. On October 13, 1999, the Company merged with LG Semicon Co., Ltd. In March of 2001, the Company changed its name from Hyundai Electronics Industries Co., Ltd. to its current name and ended its affiliation with the Hyundai Business Group. The Company headquarters in Ichon with a branch office in Seoul and has production plants in Ichon, Cheongju, Gumi in korea and Eugene, Oregon in the United States of America. It’s major business scope include DRAM, SRAM, NAND Flash and MCPs. For more information, please visit http://www.hynix.com/eng/index.jsp

 

About ChipMOS TECHNOLOGIES (Bermuda) LTD.:

 

ChipMOS (www.chipmos.com.tw) is a leading independent provider of semiconductor testing and assembly services to customers in Taiwan, Japan, and the U.S. With advanced facilities in Hsinchu and Southern Taiwan Science Parks in Taiwan and Shanghai, ChipMOS and its subsidiaries provide testing and assembly services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

 

Forward-Looking Statements

 

Certain statements contained in this announcement may be viewed as “forward-looking statements” within the meaning of Section 27A of the U.S. Securities Act of 1933, as amended, and Section 21E of the U.S. Securities Exchange Act of 1934, as amended. Such forward-looking statements involve known and unknown risks, uncertainties and other factors, which may cause the actual performance, financial condition or results of operations of the Company to be materially different from any future performance, financial condition or results of operations implied by such forward-looking statements. Further information regarding these risks, uncertainties and other factors is included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the “SEC”) and in the Company’s other filings with the SEC.